添加CaF2-YF3的AlN陶瓷的热导率

用CaF2和YF3做添加剂，在1750℃制备了热导率高于170W/m.K的的AlN陶瓷，并用XRD和SEM研究了AlN陶瓷在烧结过程中的相组成，微结构以及晶格参数的变化，并讨论了其对热导率的影响，研究发现，当使用CaF2-YF3做添加剂时，微结构差异对AlN陶瓷热导率的影响很小，AlN陶瓷的热导率主要由AlN晶格氧缺陷浓度决定，由于CaF2-YF3能有效降低AlN颗粒表面的氧含量，从而有利于获得高的热导率。     

The thermal ignition of lignocellulosics in infinite slab and cubic geometries

Wood shaving samples were heated in both cubic baskets and in a previously described system realising the conditions of the ‘infinite slab’ in thermal ignition. Results from the two sets of experiment were found to be totally consistent with each other.     

Thermal Shock Behavior of Porous Silicon Carbide Ceramics

Using the water-quenching technique, the thermal shock behavior of porous silicon carbide (SiC) ceramics was evaluated as a function of quenching temperature, quenching cycles, and specimen thickness. It is shown that the residual strength of the quenched specimens decreases gradually with increases in the quenching temperature and specimen thickness. Moreover, it was found that the fracture strength of the quenched specimens was not affected by the increase of quenching cycles. This suggests a potential advantage of porous SiC ceramics for cyclic thermal-shock applications.     

Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%     

Synthesis and characterization of novel diimide–dinaphthols and resulting poly(urethane–imide)s

Novel diols containing imide groups were prepared via condensation of aromatic dianhydrides with 5‐amino‐1‐naphthol. The diimide–dinaphthols prepared were characterized by conventional methods and used to synthesize new poly(urethane–imide)s (PUIs). All the polymers were characterized and their physical properties, such as solubility, solution viscosity, thermal stability, and thermal behaviour were studied. The polymers obtained showed more thermal stability than typical polyurethanes because of the presence of the imide groups. Copyright © 2003 Society of Chemical Industry     

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Addressing the potential for drop impact failure of Pb-free interconnects, the shear ductility after extensive aging of Sn-Ag-Cu (SAC) solders has been improved radically by Co or Fe modifications. Several other SAC+X candidates (X=Mn, Ni, Ge, Ti, Si, Cr, and Zn) now have been tested. Solder joint microstructures and shear strength results show that new SAC+X alloys also suppress void formation and coalescence at the Cu (substrate)/Cu₃Sn interface (and embrittlement) after aging at 150°C for up to 1,000 h. Microprobe measurements of 1,000 h aged samples suggest that Cu substitution by X is usually accentuated in the intermetallic layers, consistent with X=Co and Fe results.     

列车客车用低温发热电缆地面辐射供暖系统的实验研究

对不同地板结构和不同导线间距下发热电缆地面辐射供暖系统的热工性能进行了测试分析，考察了系统的稳定性和可靠性，给出了综合比较结果，分析了影响发热电缆地面辐射供暖系统热工性能的主要因素及其影响规律。     

Characterization of resol resins modified by the addition of PVC plastisols

Plastisols, which are a blend of poly(vinyl chloride) resin and a plasticizer (DEHP), were used as a toughening agent of a resol resin in order to improve the mechanical properties. It was not possible to formulate resol blends by adding more than 10 % of plastisol owing to a lack of apparent homogeneity in the systems, which also showed many air bubbles. The relationship between dynamic mechanical, mechanical and thermal properties and the amount of plastisol added was studied. It was determined from the infrared spectroscopy and dynamic mechanical results that the resol–plastisol blends seem to be formed by a reaction between the phenol and PVC giving a higher crosslinked structure. An improvement in the thermal resistance of the blends at lower temperatures was observed with an increase in the percentage of plastisol. Flexural analysis showed the elastic behaviour of the systems. However, it was not possible to observe the effect of the plasticizer (DEHP) owing to the low quantity of plastisol that was added to the resol. Copyright © 2004 Society of Chemical Industry     

Conducting composites of polythiophene and polyfuran with acetylene black

Conducting composites of polythiophene (PTP) and polyfuran (PF) with acetylene black (AB) were prepared via chemical oxidative polymerization of thiophene and furan in a suspension of AB in CHCl₃ at room temperature using anhydrous FeCl₃ as the oxidant. Formation of PTP and PF and their subsequent incorporation in PTP–AB and PF–AB composite systems were confirmed by FTIR analysis. Scanning electron microscope analysis showed the presence of compact clusters of particles in both composites. Transmission electron micrographs of PTP–AB and PF–AB composites showed formation of globular polymer encapsulated AB particles with average diameters of the order of ～100 nm in both systems. Thermogravimetric analysis revealed that the overall thermal stability varied in the order: AB > PTP–AB > PTP and AB > PF–AB > PF. DC conductivity values for the PTP–AB and PF–AB composites were of the order of 10^?2 and 10^?3 S cm^?1, respectively. Copyright © 2004 Society of Chemical Industry